LaNiXMY合金膜の電気化学的水素吸蔵特性

概要

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The hydrogen absorption characteristics of sputtered LaNiXMY alloy films (M=Al and Cu) were examined using a number of electrochemical methods. The alloy films did not exhibit a clear dissociation pressure plateau in P-C-T curves, probably because of their amorphous structure. The hydrogen dissociation pressure of La-Ni alloy films increased as the amount of nickel component increased. In contrast with LaNiXMY films, it decreased with the addition of aluminum or copper. The apparent plateau pressure of the LaNi5.1 film was estimated to be on the order of 104 Pa at 0°C, and that of the LaNi4.5 Al0.1 film was estimated to be on the order of 102 Pa at 20°C. Addition of aluminum was highly effective in lowering the hydrogen dissociation pressure. Elevation of the electrode operation temperature decreased the amount of hydrogen absorbed in the films. However at high temperature the amount of hydrogen that could be discharged galvanostatically increased. It could be considered that this occurred because the improvements in the reactivity and the hydrogen diffusion of alloy films at high temperature resulted in a fall in the discharge overvoltage, and because the dischargeable region of the hydrogen concentration in the P-C-T curves was extended.
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