リン青銅スズ, はんだめっき材の熱はく離に及ぼすめっき条件の影響

概要

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The effects of plating conditions on the thermal peeling of tin or solder plated phosphor-bronze were examined.Main findings are summarized as follows.1. The resistance to thermal peeling of reflowed tin films with 0.5μm copper undercoat was highest when plated in a phenolsulfonate bath, while that of reflowed tin films with no undercoat was highest when plated in a sulfate bath.2. Thermal peeling took place more readily and was less sensitive to plating bath composition for bright solder films than for reflowed tin films. In phosphor-bronze that was bright solder plated in a methanesulfonate bath, thermal peeling was observed after aging at room temperature for 16, 000h.3. An arrhenius type relation was obtained between the aging time to peeling and aging the temperature.
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