リン青銅スズめっき材の熱はく離に及ぼす合金元素および下地銅めっきの影響

概要

論文の詳細を見る
To clarify the mechanism of thermal peeling, that is to say the thermally accelerated loss of adhesion of coated films, the effects of alloying elements and copper undercoat on the propensity to thermal peeling were examined using tin-coated copper and copper alloys.Main findings are summarized as follows. The presence of tin in the phosphor-bronze promotes thermal peeling when the tin layer has a copper undercoat 0.5μm thick or less, but the aging time necessary for thermal peeling to occur does not depend on the concentration of tin. On the other hand, the propensity to thermal peeling increases with higher phosphorus concentration in the phosphor-bronze regardless of whether there is a copper undercoat or not. Alloying phosphor-bronze with 0.1∼0.3wt% of Zn, Mn and/or Fe increased the resistance to thermal peeling.Within the range of conditions covered by these detailed tests, no thermal peeling from phosphor-bronze takes place when there is a reflowed tin-plated film, provided that either the thickness of the copper undercoat is greater than 3μm, or that without copper undercoat phosphorus concentration is less than 0.3wt%.
社団法人表面技術協会の論文