無触媒プロセスによる銅上への無電解ニッケルめっき膜の析出機構

概要

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The authors investigated a method for electroless plating of nickel with no catalyzer, onto a substrate consisting of copper foil hot-pressed onto polyimide resin, using dimethylamine borane as the reducing reagent. When the substrate surface was oxidized before plating, reduction of the nickel ion was promoted. When solution temperature was high, the copper oxide film was reduced rapidly to copper and its surface morphology was similar to that of the original oxide surface. Accordingly the authors propose mechanism for the reduction of copper oxide film in an electroless nickel plating solution whereby:1) If reduction of the oxide film is rapid, the film partially dissolves into the plating solution, and copper ions in the solution are reduced to copper metal and deposited. Undissolved copper oxide is directly reduced to copper in the film in parallel with the above reaction.2) If reduction of the oxide film is slow, almost all the film dissolves into the plating solution, and the copper ions in solution are reduced to copper metal and deposited.3) The copper metal that has been reduced and deposited is in the active state and a part of it promotes the reduction and deposition reactions of the nickel ion.