グロー放電洗浄によるスパッタ装置の排気時間短縮

概要

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Sputtering system for semiconductor manufacturing need high vacuum condition. It takes long time to recover high vacuum after the chamber is opened to the air. In order to increase operating efficiency of the system, it is required to reduce the recovering time. So, in this study, glow discharge cleaning technique is applied using a glow-mode plasma source in argon gas. Discharge current distribution inside the sputtering system is measured ubder the various conditions. Following results are obtained form the test : It is proved that the lower pressure (here 3 × 10<SUP>-3</SUP> Torr) and the higher anode currents or voltage are adopted, the more uniform distribution is obtained using two electrodes rather than one. By applying these results, the drastic reduction of pumping time is achieved. The pumping time to attain the pressure of 1.5 × 10<SUP>-6</SUP> Torr is reduced to 6 hours by the 3.5 hours discharge cleaning although the conventional method needs 17 hours.
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