Formation of Fine Circuit Patterns on Cyclo Olefin Polymer Film

スポンサーリンク

概要

• 論文の詳細を見る

• In recent years, with the miniaturization of electric devices, the demand for flexible printed circuits (FPCs) using polyimide has increased, because of its excellent heat resistance and size stability. Polyimide also has good flexibility and surface smoothness. However, polyimide absorbs moisture readily and is highly permeable to gas. In contrast, Cyclo Olefin Polymer (COP) has low moisture absorption, excellent size stability and excellent high frequency electrical properties. Therefore, COP is attractive as a substrate for FPCs. However, it is difficult to form a metal film using electroless plating on the COP with conventional processes. We could form a copper film with high adhesion strength while maintaining a smooth resin surface by modifying the surface using UV irradiation. Surface modification by UV irradiation was effective to achieve good adhesion (about 1.0 kN/m) between the COP resin and the deposited metal without roughening the COP surface. The interface electric conductivity of the printed circuit on COP produced by this method indicated a value of approximately 80% up to around 30 GHz.

著者

• Honma Hideo

  Faculty Of Engineering Kanto Gakuin University

• Watanabe Mitsuhiro

  Kanto Gakuin Surface Engineering Research Institute

• Baba Kunihito

  Faculty of Engineering, Kanto Gakuin University

• Nishimura Yoshiyuki

  Faculty of Engineering, Kanto Gakuin University

関連論文

• Direct Electroless Copper Plating on Glass
• Fabrication of a Near-Field Optical Fiber Probe Based on Electroless Nickel Plating under Ultrasonic Irradiation
• Surface Modification of Polyimide Using UV Light and Formation of Circuit Patterns
• Properties of PLZT Shutter with Copper Plating Electrodes : O: OPTOELECTRONICS
• Formation of Fine Circuit Patterns on Cyclo Olefin Polymer Film
• Fabrication of a Near-Field Optical Fiber Probe Based on Electroless Nickel Plating under Ultrasonic Irradiation

スポンサーリンク