Two-Step Reduction Process for Direct-Metallization
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概要
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Flexible Printed Circuits (FPCs) have been commonly utilized for electric gadgets such as Liquid Crystal Displays (LCDs). Direct-Metallization is a promising method for plating highly conductive copper onto the polyimide films when fabricating the FPCs. In this paper, we suggest a two-step reduction process to improve the adhesion between the polyimide film and the precipitated copper metal with an enhanced mechanical interlocking effect. The peel strength of the metalized polyimide-based film is improved from 0.3 to 0.8 kN/m by adopting this process. Observation of the boundary structure between the copper metal and polyimide film reveals that the precipitating small and uniformly-sized copper particles are distributed just below the surface of the polyimide.
著者
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Nawafune Hidemi
Department Of Chemistry Faculty Of Science And Engineering And High Technology Research Center Konan
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Imataki Tomoo
Production Innovation Center, Sharp Corporation
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Morita Yoshiro
Production Innovation Center, Sharp Corporation
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Murayama Rina
Production Innovation Center, Sharp Corporation
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Ogawa Masashi
Production Innovation Center, Sharp Corporation
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Matsubara Hiroshi
Production Innovation Center, Sharp Corporation
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Nawafune Hidemi
Department of Nanobiochemistry, Faculty of Frontiers of Innovative Research in Science and Technology, Konan University
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