Electroless copper plating using Sn(II) complex as a reducing agent for ULSI metallization
スポンサーリンク
概要
著者
-
Nawafune Hidemi
Department Of Chemistry Faculty Of Science And Engineering And High Technology Research Center Konan
-
AKAMATSU Kensuke
Department of Chemical Science and Engineering, Faculty of Engineering, Kobe University
-
Murakami Yoshiki
Matsushita Technoresearch Inc
-
Kobata Yuichiyo
Department of Chemistry, Faculty of Science and Engineering
-
Morikawa Yuji
Department of Chemistry, Faculty of Science and Engineering
-
Morikawa Yuji
Department Of Chemistry Faculty Of Science And Engineering
-
Kobata Yuichiyo
Department Of Chemistry Faculty Of Science And Engineering
-
Akamatsu K
Department Of Chemistry Faculty Of Science And Engineering And High Technology Research Center Konan
-
Kobata Yuichiro
Department of Chemistry, Faculty of Science and Engineering
関連論文
- Effects of Exogenous Amino Acids on Iron Uptake in Relation to their Effects on Photoperiodic Flowering in Lemna paucicostata 6746
- Single-Electron Tunneling Effects in Nylon 11 Thin Films Containing Nanoparticles
- Two-Step Reduction Process for Direct-Metallization
- Electroless copper plating using Sn(II) complex as a reducing agent for ULSI metallization
- In Situ Generation of Silver Nanoparticles in Ion-exchangeable Polymer Photonic Crystals
- Single-Electron Tunneling Effects in Nylon 11 Thin Films Containing Nanoparticles