1A2-C28 パッケージング小型レーザ変位センサの開発 : ロボティクス応用に向けたセンサ特性の評価

概要

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In this study, a micro-laser-displacement sensor with packaging, which consists of upper and lower glass substrates and a silicon spacer substrate, is developed and evaluated. The sensor has a VCSEL (Vertical-Cavity Surface-Emitting Laser) and PD (Photo Diode) chips for displacement sensing, and the packaging for their chips is fabricated by MEMS technology. The dimensions of the sensor are 3mm×3.3mm and 1.5mm thick. The designed sensor is able to measure the displacement of a movable target-plate, by emitting laser light from the VCSEL and detecting the light reflected from the target-plate with the PDs. The experimental results show that the detectable stroke is more than 15mm when a mirror is used as the target. Thus, it is expected that the developed sensor is applied to non-contact and/or proximity sensor for robotics and mechatronics applications.