Applications of Smart Cut^<TM> Technologies to III-V Based Engineered Substrates
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概要
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Applications of Smart Cut^<TM> technologies are reviewed focusing on III-V materials. Smart Cut can realize quite a high-performance structure by the best combination of materials for the device layer and the substrate. Wafer reclaim capability can also contribute to effective reduction of the wafer cost, together with selection of inexpensive material for the substrate.
- 2010-06-23
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