E-5 Piezocomposite Ultrasonic Transducer for High-Frequency Wire-Bonding of Microelectronics Devices(Bulk wave devices, High power ultrasound)

スポンサーリンク

概要

• 論文の詳細を見る
• 超音波エレクトロニクスの基礎と応用に関するシンポジウム運営委員会の論文
• 2005-11-16

著者

• Chan Helen

  The Hong Kong Polytechnic University

• Or Siu

  The Hong Kong Polytechnic University

• Liu Peter

  Asm Assembly Automation Ltd.

• Or Siu

  Department Of Applied Physics The Hong Kong Polytechnic University

関連論文

• PMN-PT single crystal and Terfenol-D alloy magnetoelectric laminated composites for electromagnetic device applications
• 2P8-9 Die Attach Filmを介してガラス基板上に半導体Dieを溶着する室温超音波溶接(ポスターセッション)
• P2-31 Tunable Vibration Absorber Incorporating Piezoceramic Sensoriactuator(Short oral presentation for posters)
• E-5 Piezocomposite Ultrasonic Transducer for High-Frequency Wire-Bonding of Microelectronics Devices(Bulk wave devices, High power ultrasound)
• Tunable Vibration Absorber Incorporating Piezoceramic Sensoriactuator
• Room-Temperature Ultrasonic Bonding of Semiconductor Thin-Dies with Die Attach Films on Glass Substrates

スポンサーリンク