H-10 EFFECT OF AGING TEMPERATURE ON INTERMETALLIC COMPOUNDS GROWTH AT INTERFACE OF Sn-3.0% Ag-0.5%Cu and Sn-3.8%Ag-1.0%Cu SOLDERS AND Cu SUBSTRATE(Session: Welding / Joining)
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概要
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The microstructure and growth of intermetallic compounds (IMCs) at the interface between Sn-3.0 %Ag-0.5 % Cu, Sn 3.8 %Ag-1.0 %Cu solder and Cu substrate during aging were studied. The soldering were conducted at 250℃ by dipping method. Cu_6Sn_5 (IMC) phase was formed instantaneously at the interface of the liquid solder and Cu substrate. During aging at 150℃ , the thickness of Cu_6Sn_5 layer grew rapidly at the beginning. The mean thickness of the IMC layer at the interface was higher for Sn-3.0 %Ag-0.5 % Cu solder alloy. However, growth rate of IMC layer decreased sharply with prolong aging time.
- 2006-11-08
著者
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Diewwanit O.
Department Of Tool And Materials Faculty Of Engineering King Mongkut's University Of Technology
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Khamwannah J.
Department of Tool and Materials, Faculty of Engineering, King Mongkut's University of Technology Th
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Phadungkietjaroen M.
Department of Tool and Materials, Faculty of Engineering, King Mongkut's University of Technology Th
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Sengkan V.
Department of Tool and Materials, Faculty of Engineering, King Mongkut's University of Technology Th
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Sengkan V.
Department Of Tool And Materials Faculty Of Engineering King Mongkut's University Of Technology
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Khamwannah J.
Department Of Tool And Materials Faculty Of Engineering King Mongkut's University Of Technology
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Phadungkietjaroen M.
Department Of Tool And Materials Faculty Of Engineering King Mongkut's University Of Technology
関連論文
- H-10 EFFECT OF AGING TEMPERATURE ON INTERMETALLIC COMPOUNDS GROWTH AT INTERFACE OF Sn-3.0% Ag-0.5%Cu and Sn-3.8%Ag-1.0%Cu SOLDERS AND Cu SUBSTRATE(Session: Welding / Joining)
- H-9 EFFECT OF SURFACE FINISH ON INTERMETALLIC COMPOUNDS GROWTH AT INTERFACE OF Sn-3.0%Ag-0.5% Cu SOLDER ON Cu/NiAu AND Cu SUBSTRATE(Session: Welding / Joining)