H-9 EFFECT OF SURFACE FINISH ON INTERMETALLIC COMPOUNDS GROWTH AT INTERFACE OF Sn-3.0%Ag-0.5% Cu SOLDER ON Cu/NiAu AND Cu SUBSTRATE(Session: Welding / Joining)
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概要
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The microstructure and growth of intermetallic compounds(IMCs) of Sn-3.0%Ag-0.5%Cu solder on substrate between Cu/NiAu and Cu were investigated after aging at 150 C for various times. In case Cu/NiAu substrate, the interface IMCs layer was (CuNi)_6Sn_5. For Cu substrate, the IMCs layer was Cu_6Sn_5. During aging at 150 C, the thickness of (CuNi)_6Sn_5 layer grew gradually but the thickness of Cu_6Sn_5 layer grew rapidly at beginning and both seem to reach a certain value. The mean thickness of IMCs at interface was quite lower for Cu/NiAu substrate.
- 2006-11-08
著者
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Diewwanit O.
Department Of Tool And Materials Faculty Of Engineering King Mongkut's University Of Technology
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Diewwanit O.
Department Of Tool And Materials Faculty Of Engineering King Mongkut's University Of Technology
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Tantivanitchanon N.
Department of Tool and Materials, Faculty of Engineering, King Mongkut's University of Technology Th
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Sirimethanon S.
Department of Tool and Materials, Faculty of Engineering, King Mongkut's University of Technology Th
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Sirimethanon S.
Department Of Tool And Materials Faculty Of Engineering King Mongkut's University Of Technology
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Tantivanitchanon N.
Department Of Tool And Materials Faculty Of Engineering King Mongkut's University Of Technology
関連論文
- H-10 EFFECT OF AGING TEMPERATURE ON INTERMETALLIC COMPOUNDS GROWTH AT INTERFACE OF Sn-3.0% Ag-0.5%Cu and Sn-3.8%Ag-1.0%Cu SOLDERS AND Cu SUBSTRATE(Session: Welding / Joining)
- H-9 EFFECT OF SURFACE FINISH ON INTERMETALLIC COMPOUNDS GROWTH AT INTERFACE OF Sn-3.0%Ag-0.5% Cu SOLDER ON Cu/NiAu AND Cu SUBSTRATE(Session: Welding / Joining)