Study of Ni/Cu plating for high-efficiency Crystalline silicon solar cells (Electron devices: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))

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概要

• 論文の詳細を見る

• The fabrication processes of high-efficiency crystalline silicon solar cells necessitate complicated fabrication processes and Ti/Pd/Ag contact, however, this contact formation processed by expensive materials. With alternative solution of like this demerit is low-cost nickel-copper metal contact has been formed by using a low-cost electroless and electroplating. Nickel-copper alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution. So, crystalline silicon solar cells of nickel-copper contact by plating are low-cost and high-efficiency. In this paper, we investigated low-cost nickel-copper contact formation of high-efficiency crystalline silicon solar cells by electroless and electroplating.

• 社団法人電子情報通信学会の論文
• 2007-06-18

著者

• Lee Eunjoo

  Strategic Energy Research Institute Dept. Electronic Engineering Sejong University

• Lee Soohong

  Strategic Energy Research Institute Dept. Electronic Engineering Sejong University

• Choi Junyoung

  Strategic Energy Research Institute Engineer, Sejong Univ

• Kim Bumho

  Strategic Energy Research Institute Engineer, Sejong Univ

• Choi Junyoung

  Strategic Energy Research Institute Dept. Electronic Engineering Sejong University

• Kim Bumho

  Strategic Energy Research Institute Dept. Electronic Engineering Sejong University

関連論文

• Investigation of low cost contact formation for crystalline Si solar cells (Electron devices: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
• Study of Ni/Cu plating for high-efficiency Crystalline silicon solar cells (Electron devices: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
• Investigation of low cost contact formation for crystalline Si solar cells (Silicon devices and materials: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
• Study of Ni/Cu plating for high-efficiency Crystalline silicon solar cells (Silicon devices and materials: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))

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