P9: Investigation of High Strength Electroformed Ni for Microprobes(SHORT ORAL PRESENTATION FOR POSTERS I)

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概要

• 論文の詳細を見る
• 一般社団法人日本機械学会の論文
• 2005-06-19

著者

• HATTORI T.

  University of Hyogo

• KIMURA T.

  Japan Electronic Materials CORP

• ARITA N.

  Japan Electronic Materials CORP

• FUKINBARA H.

  Japan Electronic Materials CORP

関連論文

• NTM-03: Fabrication of Spiral Micro-Coil Utilizing LIGA Process(NTM-I: NON TRADITIONAL MANUFACTURING PROCESS)
• P6: Precise Micro Pattern Replication by Hot Embossing(SHORT ORAL PRESENTATION FOR POSTERS I)
• P9: Investigation of High Strength Electroformed Ni for Microprobes(SHORT ORAL PRESENTATION FOR POSTERS I)
• ICS-12: Bonding Dissimilar Materials by Exposure to an H_2O Ion Beam(ICS-II: INTERFACES AND CONTACT SURFACE MECHANICS)

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