A Comparative Machining Study of TiCN, TiAIN and Diamond Coated Tools in Micro End Milling of Silicon Wafer(M^4 processes and micro-manufacturing for science (continued))

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概要

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• Single Crystal Silicon is used in the development of devices for optoelectronics and micro electromechanical systems (MEMS) applications. Silicon is a brittle material and is not amenable to conventional machining operation because of its low fracture toughness. Currently, the basic technology for these products is lithography. Lithography can make it possible to produce 2-D shape details, but the production of 3-D shape details has many problems. An alternate approach would be to machine it with micro end-milling without the need for subsequent processing. Micro end milling has also been shown to be very versatile and rapid method for the removal of material. Recently, micro end milling is applied in electronics, biomedical and aerospace industries. For cutting silicon, the cutting tools must have higher hardness than silicon. TiCN, TiAIN and diamond coated tools with diameter of 0.2mm are evaluated in micro end milling experiments. The work pieces are used in the as-polished state in order to avoid any surface and subsurface damage created by any processing before micro milling. The objective of using varies of cutting tools is to compare the cutting tools performance in micro end milling of silicon wafer. The milling performance of the tools was evaluated in terms of ductile cutting mode.

• 2005-10-18

著者

• KIM H.

  School of Mechanical and Aerospace Engineering, Gyeongsang National University

• Ko T.

  School of Mechanical Engineering, Yeungnam University

• Kim H.

  School Of Mechanical Engineering Yeungnam University

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