Study on Non-Crack Glass Machining by Means of UV Laser with Absorbent(Laser processing (continued))

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概要

• 論文の詳細を見る

• Methods of UV laser machining for glass are now highly required. However, cracks generate on glass when the glass is merely irradiated with a laser. One of the solutions is to utilize laser absorbent. In this paper, three kinds of absorbent, i.e. plate-like absorbent, powder absorbent and liquid absorbent, were examined for a groove, a deep hole and a 3D micro channel within glass, respectively. In the experiments, the proper machining conditions were investigated in order to fabricate the microstructure without cracks. As a result, a deep hole and a bending micro channel can be fabricated.

• 一般社団法人日本機械学会の論文
• 2005-10-18

著者

• Mitsuishi Mamoru

  The University Of Tokyo

• KONO Ippei

  The University of Tokyo

• NAKANISHI Akira

  The University of Tokyo

• Warisawa Shin'ichi

  The University Of Tokyo

関連論文

• Study on Non-Crack Glass Machining by Means of UV Laser with Absorbent(Laser processing (continued))
• Simultaneous Measurement of Surface Shape and Absolute Optical Thickness of a Glass Plate by Wavelength Tuning Phase-Shifting Interferometry

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