シリコングリスによる接触熱抵抗の低減に関する実験的研究(J01-6 無抵抗評価,J01 エレクトロニクス実装における熱制御および信頼性評価)

概要

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In the electronic equipment like personal computers with high heat fluxes for instance, the thermal contact resistance (TCR) plays an important role in heat removal process. In such equipment, an interstitial material is often introduced between the heat sink and the heat source to reduce TCR. In this study, in succession from the previous, studies, the effect of grease layer on TCR between contacting surfaces with waviness has been investigated experimentally. As a result, it has been clarified that the thickness of the grease layer is about 24μm, and by applying such thin layer at the interface, fairly good reduction effect of TCC is obtained.
一般社団法人日本機械学会の論文
2004-09-04