523 Effects of Sub-Interfacial Cracks on the Fracture Behavior of HIP Bonded Copper-Mild Steel Plates
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概要
- 論文の詳細を見る
- 一般社団法人日本機械学会の論文
- 2004-11-05
著者
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Willett A
熊本大院
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Willett Andrew
熊本大院
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Oda I
熊本大
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Oda Isamu
Osaka University
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ODA Isamu
熊本大
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YAMAMOTO Mitsuharu
熊本大院
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SOSOGI Yasuhide
熊本大院
関連論文
- 523 Effects of Sub-Interfacial Cracks on the Fracture Behavior of HIP Bonded Copper-Mild Steel Plates
- Fracture Behavior of HIP Bonded C1100 Copper and SS400 Mild Steel
- Fracture Behavior of HIP Bonded C1100 Copper and SS400 Mild Steel
- Development of High-speed and High-precision FEM for Analysis of Mechanical Problems in Welding(Mechanics, Strength & Structure Design)
- Prediction of the Strength of Joints between Dissimilar Elastic Materials(Mechanics, Strength & Structural Design)