Fracture Behavior of HIP Bonded C1100 Copper and SS400 Mild Steel
スポンサーリンク
概要
- 論文の詳細を見る
- 2003-12-15
著者
-
Willett A
熊本大院
-
Oda Isamu
Osaka University
-
ODA Isamu
Department of Mechanical Engineering and Materials Science, Kumamoto University
-
WILLETT Andrew
Department of Mechanical Engineering and Materials Science, Kumamoto University
-
SOSOGI Yasuhide
Department of Mechanical Engineering and Materials Science, Kumamoto University
-
YAMAMOTO Mitsuharu
Department of Mechanical Engineering and Materials Science, Kumamoto University
関連論文
- 523 Effects of Sub-Interfacial Cracks on the Fracture Behavior of HIP Bonded Copper-Mild Steel Plates
- Fracture Behavior of HIP Bonded C1100 Copper and SS400 Mild Steel
- Fracture Behavior of HIP Bonded C1100 Copper and SS400 Mild Steel
- Development of High-speed and High-precision FEM for Analysis of Mechanical Problems in Welding(Mechanics, Strength & Structure Design)
- Prediction of the Strength of Joints between Dissimilar Elastic Materials(Mechanics, Strength & Structural Design)
- External Carotid Artery Aneurysm Developing After Embolization of a Buptured Posterior Inferior Cerebellar Artery Aneurysm in a Patient With Cervicocephalic Fibromuscular Dysplasia
- Radiation-Induced Osteosarcoma 16 Years After Surgery and Radiation for Glioma : Case Report