Ultra-Low Resistance, Through-Wafer Via (TWV) Technology and Its Applications in Three Dimensional Structures on Silicon

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概要

• 論文の詳細を見る

• This paper presents an ultra-low resistance, high wiring density, through-wafer via (TWV) technology that is compatible with standard silicon wafer processing. Vias as small as 30 μm by 30 μm are fabricated through a 525 μm thick wafer. This results in an aspect ratio for the via that is greater than 17:1. Furthermore, the dc resistance of a single via is less than 50 mΩ. Key fabrication steps, including the silicon dry etch, copper metallization, and photoresist electroplating, are described in detail. As a demonstration of the potential applications of the TWV technology, a novel three dimensional inductor is designed and fabricated. For a 0.9-nH inductor, a quality factor of 18.5 is measured at 800 MHz.

• 社団法人応用物理学会の論文
• 1999-04-30

著者

• Lee Thomas

  E. L. Ginzton Laboratory And Center For Integrated Systems Stanford University

• Mccarthy Anthony

  Lawrence Livermore National Laboratory

• Yue C.patrick

  E. L. Ginzton Laboratory And Center For Integrated Systems Stanford University

• SOH Hyongsok

  E. L. Ginzton Laboratory and Center for Integrated Systems, Stanford University

• RYU Changsup

  E. L. Ginzton Laboratory and Center for Integrated Systems, Stanford University

• WONG S.Simon

  E. L. Ginzton Laboratory and Center for Integrated Systems, Stanford University

• QUATE Calvin

  E. L. Ginzton Laboratory and Center for Integrated Systems, Stanford University

• Ryu Changsup

  E. L. Ginzton Laboratory And Center For Integrated Systems Stanford University

• Soh Hyongsok

  E. L. Ginzton Laboratory And Center For Integrated Systems Stanford University

• Quate Calvin

  E. L. Ginzton Laboratory And Center For Integrated Systems Stanford University

• Wong S.simon

  E. L. Ginzton Laboratory And Center For Integrated Systems Stanford University

関連論文

• Ultra-Low Resistance, Through-Wafer Via (TWV) Technology and Its Applications in Three Dimensional Structures on Silicon
• Ultra-Low Ressitance, Through-Wafer Via (TWV) Technology and Its Applications in Three Dimensional Structures on Silicon

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