Nanometer Patterning by Focused Low Energy Electron Beam Lithography
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概要
- 論文の詳細を見る
Focused low energy electron beam was applied for nanometerscale pattern delineation. A resist exposure with an electron energy less than 10 kV causes two problems, that is, a limited penetration depth and the scum formation due to charging-up effect. These problems were solved by using an electrically conducting 2-layer resist system composed of thin top imaging layer of silicone containing resist and conducting CVD carbon film as a bottom resist. Nanometer patterning as fine as 40 nm can be delineated by very low energy electron exposure with no electron energy dissipation in a substrate layer.
- 社団法人応用物理学会の論文
- 1987-07-20
著者
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Kakuchi Masami
Ntt Electrical Communications Laboratories
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Sugita A
Ntt Electrical Communications Laboratories
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Sugita Akio
Ntt Electrical Communications Laboratories
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Tamamura Toshiaki
Ntt Electrical Communications Laboratories
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- Nanometer Patterning by Focused Low Energy Electron Beam Lithography