Synchrotron Radiation-Assisted Etching of Silicon Surface
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概要
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The photo-assisted etching of heavily phosphorous-doped polycrystalline silicon by chlorine was studied using synchrotron radiation as an extreme ultraviolet (EUV) light source. The quantum yield for the removal of the Si atoms at a chlorine pressure of 0.3 Torr was found to be about 0.5% photon^<-1> using the Ti-filtered light, which is mostly in the EUV region, 1-20 nm. Formation of electronically excited Cl^+ ions upon EUV irradiation was confirmed by emission spectroscopy. Negative bias applied to the Si crystal was found to increase the etch rate.
- 社団法人応用物理学会の論文
- 1987-07-20
著者
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HIRAYA Atsunari
Institute for Molecular Science
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Hayasaka Nobuo
Institute For Molecular Science:vlsi Research Center Toshiba Corporation
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Shobatake K
Department Of Molecular Design And Engineering Graduate School Of Engineering Nagoya University
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SHOBATAKE Kosuke
Institute for Molecular Science
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- Synchrotron Radiation-Assisted Etching of Silicon Surface