Repair of Electromigration-Induced Voids in Aluminum Interconnection by Current Reversal

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概要

• 論文の詳細を見る

• Void generation and resistance increase in aluminum stripe due to electromigration under high-density dc current are recovered by reversal of the direction of the current. Thermal annealing without the application of high density current had no effect of void repair. This implies that the void repair is driven by the reverse current with the transport of aluminum atoms.

• 社団法人応用物理学会の論文
• 1993-04-15

著者

• Hoh Koichiro

  Faculty Of Engineering Yokohama National University:faculty Of Engineering The University Of Tokyo

• Hong Chao-fu

  Faculty Of Engineering Yokohama National University

• Togo M

  Nec Corp. Kanagawa Jpn

• Togo Mitsuhiro

  Faculty Of Engineering Yokohama National University

関連論文

• Repair of Electromigration-Induced Voids in Aluminum Interconnection by Current Reversal
• Influence of Grain Boundary Configuration in Aluminum Films on Abrupt Resistance Changes during Electromigration

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