A New Method for the Precise Measurement of Wafer Roll off of Silicon Polished Wafer

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概要

• 論文の詳細を見る

• A new method using a stylus profiler and a block gauge has been developed to measure the precise profile of wafer roll off occurred within the edge exclusion length. The results from the new method have a good agreement of those using the conventional capacitive gauging tool, when the height deviation of wafer roll off is measured. The new method can specify the exact lateral position with respect to the physical edge of wafer.

• 社団法人応用物理学会の論文
• 1999-01-15

著者

• Yakushiji Kenji

  Silicon R&d Center Showa Denko K.k.

• KIMURA Masahiro

  Silicon R&D Center, Showa Denko K.K.

• SAITO Yasuo

  Silicon R&D Center, Showa Denko K.K.

• DAIO Hiroshi

  Silicon R&D Center, Showa Denko K.K.

• Daio Hiroshi

  Silicon R&d Center Showa Denko K.k.

• Daio Hiroshi

  Silicon R & D Center Showa Denko K.k.

• Kimura Masahiro

  Silicon R&d Center Showa Denko K.k.

• Saito Yasuo

  Silicon R&d Center Showa Denko K.k.

関連論文

• A New Method for the Precise Measurement of Wafer Roll off of Silicon Polished Wafer
• Bi-Surface Photoconductivity Decay Analysis for Polysilicon Back Sealed Wafers with Thermal Process Induced Contamination

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