Cu Electromigration Effect on Cu_<2-x>Se Film Properties
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概要
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Electrical and optical properties and structural change of vacuum-deposited Cu_<2-x>Se films due to electromigration have been investigated using Au/Cu_<2-x>Se/Cu(or Au) samples. DC voltages were applied to them to cause Cu migration. Under the bias in which the polarity of the Cu electrode was negative, Cu in Cu_<2-x>Se films decreased gradually, which increased Cu vacancies and carrier density. Under the bias in which the Cu electrode was positive, Cu ions were supplied to Cu_<2-x>Se films and Cu vacancies were filled, which decreased carrier density and changed the film structure to α-Cu_<2-x>Se. Small blocks of Cu accumulation were formed at the negative electrode edge.
- 社団法人応用物理学会の論文
- 1990-10-20
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