軟鑞接の研究(第 3 報) : 軟鑞の黄銅上の濡れについて

概要

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On the 2nd report was reported the wetting of the soft solder on copper. After solidification soft solder of Pb 60% on copper spreads largest, but the richer the tin is, the greater the adhesional wetting is, and the spreading coefficient of solder of Pb 40% is greatest, and the lower the heating temperature of solder, the more wettability. This report is a reasearch for the wettability on brass, Cu_3Sn and Cu_6Sn_5. 1) Spreading area of solder after solidification on brass and copper is independent of its surface tension and depends only on the contact angle when the volume of liquid solder is very small and constant. 2) Spreading area of solder on Cu_3Sn is greatest in the solder of Pb 60%, but solders on Cu_6Sn_5 inspite of the composition of solder spread almost perfectly and have not contact angle, therefore formation of Cu_6Sn_5 between copper, brass and solder have the important influence on spreading. 3) Wettability does not depend on the material soldered, brass and copper and the sorts of flux, but depends on the solders themselves. 4) Wettability of solders on brass is greater than on copper, but spreading area of soft solder after solidification on copper is greater than on brass. 5) The tendency of variation of sprcading coefficient by the composition of solder is some with the contact angle of liquid solder on copper and brass. 6) Wettability is greater in inorganic flux than in organic flux.
社団法人溶接学会の論文
1960-04-25