軟鑞接の研究(第 2 報) : 軟鑞の銅上の濡れについて

概要

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The phenomenon of wetting has generally three types, adhesional wetting, immersional wetting and spreading wetting. The degree of wettability are in general represented by θ, T cosθ or T (cosθ+1), but on soldering not only adhesional wetting but also spreading wetting is recognized as the very important factor. Author measured the spreading area and contact angle of Pb-Sn solders after solidification on copper plate and calculated the adhesional wetting and spreading wetting of Pb-Sn solders in molten state on copper wire with fluxes. 1) Spreading area of solder after solidification is greater in inorganic flux than in organic flux and solder spreades largest on copper in a satulated aqueous solution of zinc-and ammonium chloride (eutectic), while smallest in a satulated alcohol solution of resin, and the solder of Pb 60% has the largest area. 2) The more the tin % is, the greater the adhesional wetting is. 3) Equilibrium contact angle of the solder of Pb 40% is minimum, and spreading coefficient is maximum. 4) The lower temperature of molten solder is, the greater the adhesional wetting and the spreading wetting are. 5) The contact angle of solder after solidification is smaller than liquid solder on copper and the minimum contact angle of solid solder occures in the solder of Pb 60% but the minimum contact angle of liquid solder in the solder of Pb 40%.
社団法人溶接学会の論文
1960-04-25