Study on the Soft Soldering (Report I) : Wettability of Solder with Corrosive and Non-corrosive Fluxes on BsP3 and Cu Plates

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概要

• 論文の詳細を見る

• Wettability of soldcr is essentially considered as a problem of interfacial tension. But as preliminary condition to above problem, mother metal surface and surface of molten solder must be clean perfectly during spreading periods of solder. In this report, authors have studied the relation between spreading phenomenon of solder by static dropping method and chemical activity of fluxes. The results obtained from above investigations are as follows. (I) The relation between erosive degree of mother metal (Cu and brass plates) and spreadability of solder is close in identity system fluxes. (II) Spreadability of solder is remarkably improved through heat dissociation of NH_4Cl in the case of addition of NH_4Cl to ZnCl_2 and decomposition of C_6H_5NH_2・HCl in Rosin-C_6H_5NH_2・HCl flux. (III) Rosin flux is a match for stearic acid flux on spreadability of solder. (Cu plate) (IV) Though chemical activity of molten ZnCl_2 flux is poor, H_2O added to ZnCl_2 has a remarkable effect on chemical activity of ZnCl_2.

著者

• Miyake Masaaki

  Course Of Welding Engineering Junior College Of Engineering University Of Osaka Prefecture

• Ueda Isamu

  Course of Welding Engineering, Junior College of Engineering, University of Osaka Prefecture

• Kawamura Masaaki

  Course of Welding Engineering, Junior College of Engineering, University of Osaka Prefecture

• Ueda Isamu

  Course Of Welding Engineering Junior College Of Engineering University Of Osaka Prefecture

• Kawamura Masaaki

  Course Of Welding Engineering Junior College Of Engineering University Of Osaka Prefecture

関連論文

• The Studies on the Soft Soldering (Report 2) : Wettability of Solders with various Fluxes on BsP3, Cu, SPC I and SUS27 Plates
• Study on the Soft Soldering (Report I) : Wettability of Solder with Corrosive and Non-corrosive Fluxes on BsP3 and Cu Plates

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