The Studies on the Soft Soldering (Report 2) : Wettability of Solders with various Fluxes on BsP3, Cu, SPC I and SUS27 Plates

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概要

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• Chemical displacement reactions between molten metal chloride fluxes and solders or base metals may be elucidated by free energy of formation of metal chlorides (⊿G_<MCl_2>). As a conclusion of above considerations, various differences in chemical displacement reactions between base metals and molten chlorides fluxes are formed. Namely, in the combination of brass plate (BsP3) and ZnCl_2-SnCl_2 system flux, chemical displacement reatcion betwe^∂n SnCl_2 in flux and Zn contained in BsP3 plate may be arised as the energy of formation of ZnCl_2 (⊿G_<ZnCl_2>) is comparatively small in comparison with ⊿G_<SnCl_2>. On the otherhand, in the combination of Cu and ZnCl_2-SnCl_2 system flux, chemical displacement reaction between SnCl_2 and Cu base metal doesn't almost arise as the value of ⊿G_<CuCl> or ⊿G_<CuCl_2> is comparatively large in comparison with ⊿G_<SnCl_2>. Nevertheless, when Cu base metal is Keeped in touch with ZnCl_2-SnCl_2 flux for a considerable length of time, chemical displacement reaction between Cu and SnCl_2 is arised as CuCl or CuCl_2 is not almost contained in the flux, and then Sn is produceed on Cu base metal. This Sn reacts with Cu to form Cu-Sn alloying layer. In the combination of 18-8 stainless steel (SUS27) plate and Sn-Pb solder, the oxides are easily eliminated with HCl. And metal is corroded by HCl. Nevertheless, in this case, a singular phenomenon which does not arise in the case of mild steel (SPCI) plate is observed when ZnCl_2-SnCl_2-NH_4Cl system flux contained large percentage of NH_4Cl and SnCl_2 is used. Namely, spread area of Sn-Pb system solder on SUS27 plate with these system flux is remarkably large. In this report, authors have discussed the spreadability of Sn-Pb system solder with various fluxes on Cu, BsP3, SPC I and SUS27 plates.

著者

• Miyake Masaaki

  Course Of Welding Engineering Junior College Of Engineering University Of Osaka Prefecture

• Ueda Isamu

  Course of Welding Engineering, Junior College of Engineering, University of Osaka Prefecture

• KAWAMURA Masaki

  Course of Welding Engineering, Junior College of Engineering, University of Osaka Prefecture

• Kawamura Masaki

  Course Of Welding Engineering Junior College Of Engineering University Of Osaka Prefecture

• Ueda Isamu

  Course Of Welding Engineering Junior College Of Engineering University Of Osaka Prefecture

関連論文

• The Studies on the Soft Soldering (Report 2) : Wettability of Solders with various Fluxes on BsP3, Cu, SPC I and SUS27 Plates
• Study on the Soft Soldering (Report I) : Wettability of Solder with Corrosive and Non-corrosive Fluxes on BsP3 and Cu Plates

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