A Slot Coupled Microstrip Antenna with a Multi-Layer Thick Ground Plane
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概要
- 論文の詳細を見る
A novel thick ground plane is proposed as a support for a slot-coupled microstrip antenna and as a heat sink for an MMIC installed on the back plane of the active array antenna. A multi-layer structure of ground planes is also studied for the benefit of easy installation of MMICs. The influence of this thick metal ground plane with a mono- and multi-layer has been investigated in detail. Both measured and calculated results of VSWR and calculated results of the back lobe are shown in detail. The calculated results of VSWR agree well with the measurements. It is made clear that the thickness of the ground plane can be extended to twenty times that of the antenna substrate while maintaining the antenna's performance. An LNA composing an MMIC was developed, attached to the back of the antenna, and operated at 23 GHz. The measured results of this active element agree well with calculated ones and confirm the applicability of the novel design.
- 社団法人電子情報通信学会の論文
- 1995-08-25
著者
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CHIBA Isamu
Mitsubishi Electric Corporation
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KARASAWA Yoshio
ATR Optical and Radio Communications Research Laboratories
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Chiba I
Mitsubishi Electric Corp. Kamakura‐shi Jpn
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Takeuchi K
Nec Corp. Sagamihara‐shi Jpn
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Takeuchi Kazunori
ATR Optical and Radio Comm. Research Labs.
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Karasawa Yoshio
Atr Optical And Radio Comm. Research Labs.
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