Description of Temperature Dependence and Creep Deformation of 60 Sn-40 Pb Solder Alloys

概要

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This paper shows the temperature effect on the deformation of 60 Sn-40 Pb solder alloys and a simulation using a constitutive model for viscoplasticity. First, a series of tests, such as creep, pure tension, and cyclic tension-compression loading were conducted to clarify the temperature effect on the deformation of 60 Sn-40 Pb solder alloys. The test results showed that the deformation of the solder alloys has a large temperature dependence. Simulations of the temperature effect on the deformation were also conducted by a constitutive model previously proposed. The parameters used in the model can be determined simply from pure tension and cyclic tension-compression loading tests at several temperatures. It was also found that the constitutive model describes not only the temperature effect on the pure tension and the cyclic tension-compression loading but also the creep curves after cyclic tension-compression preloading.
一般社団法人日本機械学会の論文
2001-01-15