OS10(2)-8(OS10W0188) Plasticity-Creep Separate Method for Viscoplastic Deformation of Lead-Free Solders

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概要

• 論文の詳細を見る
• 一般社団法人日本機械学会の論文
• 2003-09-09

著者

• SASAKI Katsuhiko

  Division of Human Mechanical Systems and Design, Hokkaido University

• Sasaki Katsuhiko

  Division Of Mechanical Science Hokkaido Univ.

• Ohguchi KenIchi

  Dept. of Material Science and Engineering, Akita Univ.

• Ohguchi Kenichi

  Dept. Materials Science And Engineering Akita Univ.

• Ohguchi Kenichi

  Dept. Of Material Science And Engineering Akita Univ.

関連論文

• Maximizing the Fundamental Frequency of Laminated Composite Plates with Optimally Shaped Curvilinear Fibers
• GS(6)-27(GSW0044) Interaction Between Cyclic Plasticity and Creep of Type 304 Stainless Steel
• OS10(2)-7(OS10W0040) Effect of Lead and Lead-Free Solders on Bend of Substrate
• Viscoplastic Deformation of Lead Free Solder Alloy- Experiments and Simulations
• Plasticity-Creep Separation Method for Viscoplastic Deformation of Lead-Free Solders(Advanced Technology of Experimental Mechanics)
• OS10(2)-8(OS10W0188) Plasticity-Creep Separate Method for Viscoplastic Deformation of Lead-Free Solders
• Description of Temperature Dependence and Creep Deformation of 60 Sn-40 Pb Solder Alloys
• Correlations between Thermal Conductivity and Inelastic Deformation of Aluminum Based Composites Containing VGCF-CNT Network

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