Closed-Form Solution for Thermo-Elastoplastic Strains in Semiconductor Chip Bonding Structures

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概要

• 論文の詳細を見る

• A closed-form solution is presented for calculating the strains produced by temperature changes in semiconductor chip bonding structures ; it is based on beam theory and elasto-perfect plastic bonding layer assumptions. This solution agrees well with three-dimensional FEM and experimental results. The parameters that govern the strains produced in bonding structures are derived from this solution. These parameters are charted in order to obtain the maximum shearing strains of bonding layers and the maximum normal stresses of chips.

• 一般社団法人日本機械学会の論文
• 1993-10-15

著者

• YASUKAWA Akio

  Mechanical Engineering Research Laboratory, Hitachi Ltd.

• Yasukawa A

  Hitachi Ltd. Tsuchiura Jpn

• Yasukawa Akio

  Mechanical Engineering Research Laboratory Hitachi Ltd .

関連論文

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