P-CM-04 FEM Analysis of Multilayered MEMS Device under Thermal and Residual Stress
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概要
- 論文の詳細を見る
It is essential to ensure their reliability to produce a MEMS on commercial scale. Reliability problem in inkjet printhead is also very important. To eject an ink drop, temperature of heater must be high so that ink contacting with surface reaches above 300℃ on the instant. Its heater is embedded in the thin multi-layer in which several materials were deposited. MEMS processes are the main sources of residual stresses development. Residual stresses are the main factor reducing the reliability of MEMS devices. We measure residual stresses of single layers that consist of multiplayer. We optimize thickness of each layer using them so that maximum stress in residual stress distribution can be minimized.
- 一般社団法人日本機械学会の論文
著者
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Choi Hyeon
Department Of Robot System Engineering School Of Information Engineering Tongmyong University Of Inf
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Park Jun
Department Of Computer Science Hongik University
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Park Jun
Department Of Robot System Engineering School Of Information Engineering Tongmyong University Of Inf
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Park Jun
Department of Applied Physics, Kyung Hee University, Yongin 446-701, Korea
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