531 Influence of flaws of wire rod surface, inclusions and voids on wire breaks in superfine wire drawing

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Accompanying increasing demands for lightweight, thin and small products, the drawing technology for fine wires is making a rapid progress. However, there are number of problems to be overcome in the field of superfine wire drawing, such as wire breaks during the drawing process that lead to low productivity and high production cost. This study analyzed wire breaks by means of the finite element analysis (FEA) that occurred in the drawing fine copper wires containing flaw on the wire surface, inclusion and void. The deformation behavior of an inclusion was examined in which the inclusion's location is assumed of the center axis of wire and the cause of wire breaks and their prevention method were clarified. The authors also clarified that drawing stress rapidly increases as a large inclusion passes through a die, inducing a wire break. It was estimated that an inclusion diameter/wire diameter ratio of 0.4 or higher increases the likelihood of wire break. When the inclusion is not in the center of wire, it was also found that necking and wire breaks appear more frequently. In addition, date obtained from actual manufacturing processes in plants was compared with the analytical results. From the simulation of the multi-pass wire drawing, the void in the wire rod were confirmed through the density measurement of experimental drawn wires. FEA showed that a flaw grew in the every processing, when small circumferential flaw is placed on the wire rod surface, and eventually becomes a surface defect, which is called a check mark in practice.
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531 Influence of flaws of wire rod surface, inclusions and voids on wire breaks in superfine wire drawing

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