314 HRTEM Studies of Plastic Deformation in Silicon Wafers due to Micro Indentation

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概要

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• The plastic deformation of silicon wafers caused by micro-indentation was studied by means of HRTEM. It was shown that under a low maximum indentation load (P_<max>) the transformation zone is amorphous but its boundary is rough and nano-crystals of diamond silicon appear near an amorphous/crystalline border. Increasing P_<max> gives rise to crystalline high-pressure R8/BC8 phases in the transformation zone. The size of high-pressure phase grains varies between 3 nm and 15 nm, suggesting a coherent nucleation and growth mechanism. The micro-deformation outside the transformation zone proceeds by initial distortion of crystalline planes concentrated in nano-zones accompanied by initiation of dislocations that are advanced to slip systems. Details of the microstructure and its effect on the nano-deformation in micro-indentation are also discussed.

• 一般社団法人日本機械学会の論文

著者

• ZHANG L.

  School of Aerospace, Mechanical and Mechatronic Engineering, The University of Sydney

• Zou J.

  Australian Key Centre For Microscopy And Microanalysis And Electron Microscope Unit The University O

• Zarudi I.

  School Of Aerospace Mechanical And Mechatronic Engineering The University Of Sydney

関連論文

• Mechanism of Force Generation in Cutting Metal Matrix Composites(Advanced machining technology)
• 314 HRTEM Studies of Plastic Deformation in Silicon Wafers due to Micro Indentation
• 209 Material Property Effect on the Surface Integrity of Ground Components

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