The Effect of Inter-metallic Compound on Thermal Fatigue Reliability of Lead-Free Solder Joints(Electronic Devices)
スポンサーリンク
概要
- 論文の詳細を見る
In this paper the authors have investigated the thermal fatigue reliability of lead-free solder joints. They have focused their attention to the formation of the intermetallic compound and its effect on the initiation and propagation behaviors of fatigue cracks. An isothermal fatigue test method was used in this study to improve the efficiency of fatigue study, and several different lead-free solder alloys, Sn-Ag-Cu, Sn-Ag-Cu-Bi, Sn-Cu and Sn-Zn-Bi were investigated. There are two kinds of fracture mode in lead-free solder joints, one is solder fatigue mode, and the other is an interface fatigue mode. Based upon the experimental results, it was found that not only is the mode transition of the fatigue crack affected by the properties of the intermetallic layer but also is affected by the tension strength of the solder material.
- 一般社団法人日本機械学会の論文
- 2001-10-20
著者
-
Shiratori Masaki
Dept. of Mechanical Engineering and Materials Science, Yokohama National Univ.
-
Yu Qiang
Dept. Of Mechanical Engineering And Materials Science Yokohama National Univ.
-
Kim Do-seop
Dept. Of Mechanical Engineering And Materials Science Yokohama National University
-
Shiratori Masaki
Dept. Of Mechanical Engineering And Materials Science Yokohama National University
-
Shiratori Masaki
Dept. Of Mechanical Engineering And Materials Science Yokohama National Univ.
関連論文
- OS12(P)-33(OS12W0087) Failure Analysis of Thinned Wall Elbows under Excessive Seismic Loading : Comparison with Experiment
- Low Cycle Fatigue Crack Growth Analysis for the Piping with a Surface Crack(Student Poster Session)
- Fatigue Reliability Evaluation for Sn-Zn-Bi and Sn-Zn Lead-Free Solder Joints
- OS10(1)-2(OS10W0196) Fatigue Strength Evaluation for Sn-Zn-Bi and Sn-Zn Lead-Free Solder Joints
- The Effect of Inter-metallic Compound on Thermal Fatigue Reliability of Lead-Free Solder Joints(Electronic Devices)
- OS10(1)-1(OS10W0109) Reliability Study on Sn-Ag-Cu and Sn-Zn-Bi Lead-Free Solder Joints and Their Intermetallic Compounds