OS10(1)-1(OS10W0109) Reliability Study on Sn-Ag-Cu and Sn-Zn-Bi Lead-Free Solder Joints and Their Intermetallic Compounds

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概要

• 論文の詳細を見る
• 一般社団法人日本機械学会の論文
• 2003-09-09

著者

• Yu Qiang

  Dept. Of Mechanical Engineering And Materials Science Yokohama National Univ.

• Yu Qiang

  Dept. Of Mechanical Engineering Yokohama National Univ.

関連論文

• OS10(1)-2(OS10W0196) Fatigue Strength Evaluation for Sn-Zn-Bi and Sn-Zn Lead-Free Solder Joints
• The Effect of Inter-metallic Compound on Thermal Fatigue Reliability of Lead-Free Solder Joints(Electronic Devices)
• OS10(1)-1(OS10W0109) Reliability Study on Sn-Ag-Cu and Sn-Zn-Bi Lead-Free Solder Joints and Their Intermetallic Compounds

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