TED-AJ03-335 SUB-DIFFRACTION LIMIT SIZED MICROMACHINING OF CRYSTALLINE SILICON BY FEMTOSECOND LASER PULSES

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概要

• 論文の詳細を見る

• Femtosecond laser has proven to be an effective tool for precise micromachining. Taking advantage of the minimized heat diffusion, lower ablation threshold, and existence of a clear ablation threshold, sub-diffraction limit sized craters have been fabricated on silicon wafers by single laser pulses of 83 fs pulse duration (FWHM) and 800 nm wavelength. Two different ablation regimes are identified by varying the laser fluence.[figure] Two-photon absorption is shown to be a dominant process in the low fluence regime. In the high laser fluence regime, electronic heat conduction is believed to be a dominant process. Time-resolved pump-and-probe side-view imaging is performed to further investigate energy absorption mechanisms in the high fluence regime. The surface-induced air plasma by the pre-pulse is observed and the absorption process of the main pulse in the plasma visualized. The decrease of the ablation efficiency in the high fluence regime is attributed to the interaction of the main pulse with the surface-induced air plasma triggered by the pre-pulse.[figure]

• 一般社団法人日本機械学会の論文

著者

• GRIGOROPOULOS Costas

  Department of Mechanical Engineering, University of California

• Grigoropoulos Costas

  Department Of Mechanical Engineering University Of California

• Hwang David

  Department Of Mechanical Engineering University Of California

• Choi Tae

  Department Of Mechatronics Kjist

• Choi Tae

  Department Of Mechanical Engineering University Of California

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