Tensile Testing of Polysilicon Thin Films using Electrostatic Force Grip

スポンサーリンク

概要

• 論文の詳細を見る

• Polysilicon thin films were tensile tested by a thin film tensile tester developed for reliability evaluation of microelectromechanical (MEMS) devices. This tensile tester has a new specimen chucking system using electrostatic force. This method enables us to handle thin (few micrometer thick) specimens easily without damage. The tensile strength of polysilicon specimens is evaluated and some fracture properties are investigated. To study variation of the reported tensile strength of polysilicon films and to check accuracy of the tensile tester, we have participated the cross comparison of tensile testing techniques.

• 一般社団法人日本機械学会の論文
• 2002-10-10

著者

• Tsuchiya Toshiyuki

  Toyota Central R & D Labs. Inc.

関連論文

• Tensile Testing of Polycrystalline Silicon Thin Films Using Electrostatic Force Grip
• Poisson's Ratio Evaluation of LPCVD Silicon Nitride Film
• Tensile Testing of Polysilicon Thin Films using Electrostatic Force Grip

スポンサーリンク