Tensile Testing of Polycrystalline Silicon Thin Films Using Electrostatic Force Grip
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概要
- 論文の詳細を見る
In this paper, a new tensile tester for thin films is presented. This tensile tester has a grip that fixes a thin film specimen using electrostatic force. The tester was constructed in a scanning electron microscope (SEM) chamber. Using this tester, the tensile strengths of polycrystalline silicon (poly-Si) thin films have been measured. The tested part of the specimen is 30-300μm long, 5μm wide and 2μm thick. The fracture of the poly-Si thin film was brittle. The mean tensile strength was 2.0-2.6GPa, depending on the length of the tested part. The size of the critical flaw that initiates fracture of the poly-Si thin film is 28-47nm, rather small than the grain size of the poly-Si thin film.
- 社団法人 電気学会の論文
著者
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Tsuchiya Toshiyuki
Toyota Central R & D Labs. Inc.
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Taga Yasunori
Toyota Central R & D Laboratories Inc.
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TABATA Osamu
Ritsumeikan University
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Sakata J
Toyota Central R&d Lab. Inc.
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Sakata Jiro
Toyota Central R & D Labs. Inc.
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Sakata Jiro
Toyota Central R&D Labs., Inc.
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