[新技術開発レポート2] 情報通信分野向け高強度極細線の開発

概要

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In response to the fast growth of the information and telecommunication industries, we developed various kinds of thinner and higher strength steel wires, including the saw wire for silicon wafer slicing (d=0.16〜0.14mm, TS≒4GPa), the brass-clad piano wire for the electric discharge machining (EDM) of the fine-blanking dies (d=0.10〜0.03mm), and the gold-plated piano wire for micro-spring manufacturing (d=0.10〜0.02mm, TS=3.5〜4.5GPa), using the newly developed hypereutectoid steel ( C≧0.90 mass%). And also, we developed the high-strength stainless steel wire (d=0.020〜0.016mm, TS≒3.3GPa) for the larger and finer metal screen for photolithography from the ultra-clean SUS304 steel. High carbon steel wires are electroplated after final heat treatment (patenting) subsequent to the intermediate drawing and redrawn to the final diameter. Stainless steel wires require approximately 99.94% (ε =7.38) of the total reduction of area for the final drawing to secure the sufficiently high strength.
2000-11-24