OS2(4)-16(OS02W0151) An Effective Transmission Technique of Higher Frequency Ultrasound into a Wafer Level Package

スポンサーリンク

概要

• 論文の詳細を見る
• 一般社団法人日本機械学会の論文
• 2003-09-09

著者

• Saka Masumi

  Dept. Of Mechanical Engineering Tohoku Univ.

• Tohmyoh Hironori

  Dept. Of Mechanical Engineering Tohoku Univ.

関連論文

• OS2(4)-15(OS02W0125) Quantitative Evaluation of Moisture in Encapsulant Resin of IC Packages by Microwaves
• OS6(P)-26(OS06W0224) Effect of Ar Gas Pressure on Growth, Structure, and Mechanical Properties of Sputtered Ti Thin Films
• OS11(4)-14(OS11W0131) Improvement of Fatigue Strength on Duralumin by Cavitation Shotless Peening
• Evaluation of Peening Intensity of Cavitation Shotless Peening by Using Almen Strip(Student Poster Session)
• OS2(4)-16(OS02W0151) An Effective Transmission Technique of Higher Frequency Ultrasound into a Wafer Level Package

スポンサーリンク