平行平板流路の壁面に置かれたモジュールから強制対流空気への複合熱伝達 : 巨視的熱コンダクタンスの実験検討

概要

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This paper reports an experimental study conducted by mounting a 31×31×7 mm^3 simulated module on the base of a 20-mm-high parallel-plate channel and cooling it by forced convective air flow. The module has a given power input ranging from 1.8 to 3.6 W. The heat transfer process is complex due to the presence of multiple heat flow paths and the coupling of heat conduction in the base and convective heat transfer from the module and base surfaces. In an attempt to understand the effects from different factors upon cooling of the module, some variables are introduced in the design of the test piece, namely, the material of the base and the thermal resistance between the module and the base. Heat transfer data were reduced to macroscopic thermal conductance components such as conjugate conductance U_<BB> of the board and direct convective thermal conductance U_A on the module.
一般社団法人日本機械学会の論文
1995-03-25