ボールボンディングツール先端形状の最適化に関する研究 : 実験シミュレーションによる非定常金属塑性流れの解析

概要

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Optimum process design of the wire ball bonding in high density LSI packaging requires information concerning with the outer profile change of the wire ball and interface condition between the wire ball and the electrode terminal pad. In the present investigation, some physial simulations of the wire ball bonding processes using the capillary tools of four different types were carried out to determine optimum tip configuration of the capillary tool. Enlarged plane strain deformation models of the wire ball and terminal pad made of aluminum and the enlarged capillary tool models made of SKD61 were employed in the physical simulations. Then, non steady-state deformation of the wire ball in the bonding process could be analyzed quantitatively in terms of the outer profile, metal flow and flow velocity, effective strain rate and effective strain. The surface conditions of the wire ball compressed on the terminal pad were also inspected quantitatively in conjunction with the slip bands formation for solid phase bonding. Referring. to the above simulation results, optimum bonding tool configuraion having some advantages for the wire ball bonding in narrow terminal pad space could be obtained successfully.
一般社団法人日本機械学会の論文
1998-03-25