微小材料機械的特性評価試験機の試作とシリコン単結晶微小素子の破壊特性評価

概要

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Quasi-static bending tests of single-crystalline silicon microelements fabricated by dicing and photoetching were performed. The microelements fabricated by photoetching (specimen width : 65-200 μm, thickness : 45-60μm) were subjected to three-point bending, with two-support roll length of l.5 mm. For this purpose, the authors have developed a specially designed testing machine (load range : 0.1 mN-5 N, accuracy : 0.02 mN) , which enables mechanical testing including fatigue of microelements. Loads were applied to a specimen by means of an electromagnetic actuator, and the displacement was measured with a differential transformer (measuring accuracy : 0.1 μm) . Mechanical testing of microelements could be thereby performed with sufficient precision. Single-crystalline silicon microelements deformed elastically until final catastrophic failure, showing a brittle nature. The influences of the fabrication process and specimen width on fracture strength were investigated, and the dominating factor on the strength was discussed.
一般社団法人日本機械学会の論文
1994-01-25