表面が局部加熱される接合膜をもつ半無限体の熱応力とその消失条件

概要

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In this study, a thermal stress problem is solved for a layered half-space when a portion of its surface is heated by temperature discontinuity. When the thermal conductivities of both materials are made equal, the solutions become those for a temperature field which does not produce any stress in the case of homogeneous material. Here it is verified whether there exists a condition for stresses to disappear between the coefficient of thermal expansion and elastic constants. As the result, we found that thermal stress disappears when α_2/α_1= 1 for plane stress, as expected, and when α_2/α_1= (1+ν_1)/(1+ν_2) for plane strain, which was not expected, α being the coefficient of thermal expansion, and ν Poisson's ratio. The physical meaning of the conditions and their extension to finite or three -dimensional bodies are discussed, and also a method of making combinations of materials of any coefficient of thermal expansion stress free is given.
一般社団法人日本機械学会の論文
1994-09-25