セラミックス-金属接合体に発生する残留応力の緩和方法に関する研究

概要

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The development of a reliable bonding technique for ceramics and metal is very important for applying ceramics to structure materials. However, there are some serious problems, one of which is the thermal stress concentration occurring near the edge of the interface bonding two materials with different mechanical and thermal properties. In this paper, residual thermal stresses near the edge of interface of bonded joints with several angles of wedge are computed by using the elastic and elastic-plastic finite element methods (FEM). The stress distribution of elastic analysis was in good agreement with Bogy's analysis. The elastic-plastic analysis was carried out for the case that temperature is altered from 800K to 300K. It was found that when stress in metal along the interface exceeds its yield strength, the order of stress singularity at the interface edge in ceramics side was nearly equal to the value obtained by Bogy's theory using very low Young's modulus. It was confirmed by using thermoelastic-plastic FEM that the stress singularity diminished at the wedge angle obtained by Bogy's theory
一般社団法人日本機械学会の論文
1991-05-25