The Application of Computer Image Processing to Stress Measurement by Copper Electroplating : Series A : Solid-Mechanics, Strength of Materials

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概要

• 論文の詳細を見る
• 一般社団法人日本機械学会の論文
• 1987-08-15

著者

• Kato Akira

  Chubu University

• Kato Akira

  Chubu Institute Of Technology

関連論文

• Damage Monitoring of Metal Materials by Laser Speckle Assisted by Image Processing Technique : Basic Experiment
• Measurement of Cyclic Stresses in High Temperature Range Using Nickel Electroplating : 2nd Report, Examination of Applicable Temperature and Accuracy of Measured Values
• Stress Concentration Factors of Semi-Circular Grooves in Torsion
• The Application of Computer Image Processing to Stress Measurement by Copper Electroplating : Series A : Solid-Mechanics, Strength of Materials

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